NUP4302MR6
PACKAGE DIMENSIONS
TSOP ? 6
CASE 318G ? 02
ISSUE P
H E
6
1
D
5
2
4
3
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
b
MILLIMETERS
INCHES
0.05 (0.002)
e
A1
A
L
c
q
DIM
A
A1
b
c
D
E
e
L
H E
q
MIN
0.90
0.01
0.25
0.10
2.90
1.30
0.85
0.20
2.50
0 °
NOM MAX
1.00 1.10
0.06 0.10
0.38 0.50
0.18 0.26
3.00 3.10
1.50 1.70
0.95 1.05
0.40 0.60
2.75 3.00
? 1 0 °
MIN
0.035
0.001
0.010
0.004
0.114
0.051
0.034
0.008
0.099
0 °
NOM
0.039
0.002
0.014
0.007
0.118
0.059
0.037
0.016
0.108
?
MAX
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
1 0 °
0.95
SOLDERING FOOTPRINT*
2.4
0.094
STYLE 12:
PIN 1. I/O
2. GROUND
3. I/O
4. I/O
5. VCC
6. I/O
1.9
0.075
0.037
0.95
0.037
1.0
0.7
0.028
0.039
SCALE 10:1
mm
inches
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NUP4302MR6/D
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